1. Chip model: TES1-7103SR 2. Temperature difference: 65 degrees Celsius 3. Voltage: 8.4V (MAX) 4. Recommended voltage: 5V 5. Assembly pressure: 85N/cm2 6. Refrigeration capacity: 13.5 (MAX) 7. Current: 3A (MAX) 8. Working environment: Temperature range -55~83 degrees Celsius (excessive ambient temperature will directly affect the refrigeration efficiency) 9. Packaging process: 704 silicone rubber seal or epoxy resin seal 10. Storage conditions ambient temperature -10~40 degrees Celsius 11. Device characteristics: red line positive electrode, black line negative electrode (literally the refrigeration surface, non-literally the heat dissipation surface) 12. When testing without heat dissipation, there will be a cooling effect. If the power is turned on, the power supply should be unplugged immediately within 1 second, otherwise the refrigeration plate will be easily burned. 13. A radiator or water-cooled heat dissipation device must be installed on the heat dissipation surface, otherwise it will burn. 14. Note: No matter whether it is water-cooled or air-cooled, thermal silicone grease must be applied 15. Wire specification: lead length 150mm 16. Dimensions: 23x23x3.6mm 17. Weight: 8 grams
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