1. Cellphone motherboard repair intelligent delamination station, one key intelligent separation/bonding function, safe and reliable, will not cause tin explosion phenomenon 2. In just 60 seconds, the heating platform heats up quickly, in 180 seconds, it can easily complete layered tasks 3. The intelligent temperature control system and high-temperature protection function ensure that the motherboard will not be damaged during operation to provide users with a safe and efficient heating experience 4. The heating platform uses efficient heating elements and heat-conduction materials, ensuring rapid heating up in just 1 minute, with its 600W peak power input 5. The heating platform features a 2.5-inch HD display that clearly shows the real-time temperature, countdown, and three temperature memory storage to keep you on top of the heating status, easily respond to various work demands 6. Multifunction key stepless dial, multifunctional stepless dial rotary key, and multiple function definition settings make it easy with one click 7. Temperature setting(Room temperature ~260 degrees Celsius): Rotate the button to adjust the temperature, click to switch the memory temperature, long press to heat up, and long press again to cool down 8. Time setting(10 sec~990 sec): Double-click to enter the time setting, adjust the setting time through the knob double-click again, or wait 5-8 seconds to confirm 9. Heat is generated during the working process and this heat needs to be dissipated through the heat dissipation hole 10. Using maintenance technology, the blocking defect of a maintenance operation is further optimized, built for the motherboard, high temperature, and no blocking, making maintenance work more convenient 11. Adopting an aluminum alloy and steel high-quality combination, not only is the appearance beautiful and generous, but it also has high hardness and excellent corrosion resistance 12. The heating platform is designed for the full series of iPhone X-15 models, to ensure better compatibility with various models, more modules continue to develop 13. Boot current fault data storage, current curve fault analysis can be checked, supports Bluetooth /WiFi wireless connection to PC applications, support remote cloud software upgrade 14. Note: This product includes only the main unit and does not contain molds. Molds need to be purchased separately (SKU: EDA0065303).
Verified Compatible
Guaranteed fit for your device. Wrong part? Full refund including shipping.
