Kaisi

Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

Name: Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
Brand: Kaisi
SKU: TBD0606276401
Availability: InStock

$19.00

Sale Sold out

In Stock - Ships in 1-3 Days

Estimated delivery:

Free Shipping

30-Day Returns

1-Year Warranty

Shipping Information

FREE SHIPPING to UK & 40+ countries. Fully insured.

Delivery: Estimated times shown at checkout based on your location (typically 6-13 days total including 1-3 days handling)

No hidden fees on orders under £135 (orders over £135 may have import duties)

Ships from China via tracked DDP service. Order by 12 AM London time for next-day dispatch.

Full shipping policy →

30-Day Money-Back Guarantee

Return unused items within 30 days (you pay return shipping). Faulty items covered at no cost to you.

Full policy →

Right Part Guarantee

Get exactly what you ordered or your money back, including shipping. 30 days, no questions asked.

Hassle-Free Returns

Start your return online in seconds. No forms, no hassle.

Return portal →.

Trusted by 80,000+ DIY & repair professionals

1. These templates can be heated for re-filling BGA unit chips, which is very simple and quick
2. It solves the problems encountered by computer maintenance engineers when using directly heated steel nets. It is durable and long-lasting
3. The success rate of tin planting is high. After proficient operation, solder balls can be formed in one go, and it is simple and convenient to use
4. High quality materials, resistant to high temperatures and wear and tear
5. Material: stainless steel

Verified Compatible

Guaranteed fit for your device. Wrong part? Full refund including shipping.

View full details