BAKU
BAKU BK-5050 150g BGA Solder Paste Flux for Mobile Phone & Computer Motherboard Repair
BAKU BK-5050 150g BGA Solder Paste Flux for Mobile Phone & Computer Motherboard Repair
In stock
🔥 Buy any 2 items, get 25% off 3rd item 🔥 Save today!
Couldn't load pickup availability
Shipping Guarantee
Shipping Guarantee
FREE SHIPPING on all UK orders. Fully insured.
Handling time: 1 - 3 business days. (Buy2fix has to process your order and put all your items through its strict quality-control tests.)
Transit time is 5 - 10 business days to the UK. Transit times to other countries are displayed at checkout.
Origin: CN
Return Guarantee
Return Guarantee
For whatever reason, if you are unsatisfied with your order within 30 days, you can return it to us in new condition for a refund minus the shipping charges.
The Right Part Guarantee
The Right Part Guarantee
The Right Part, Guaranteed. If we send the wrong part (not as described), our 30-day return policy has you covered. You get a full refund, including the shipping fees.
Hassle-Free Returns
Hassle-Free Returns
Start Your Return in Seconds with Our Easy Online Return Portal.
1. Crafted with high-quality 63% tin and 37% lead alloy, this solder paste delivers excellent thermal conductivity and stable melting performance, ensuring durable and reliable solder joints for BGA and SMT applications.
2. Made with halide-free materials and no harmful additives, this solder paste complies with environmental safety standards. Safe for operators and ideal for electronics repair without corrosion risks.
3. No-Clean, Low-Residue Efficiency: Minimal post-welding residue eliminates the need for cleaning, saving time and reducing workflow steps. Perfect for high-precision tasks like smartphone and PC motherboard repairs.
4. 25-45μm Micro Particles for Precision: Ultra-fine particle size (25-45μm) ensures smooth tin loading and even distribution, preventing issues like bridging, tin beads, or cold joints. Ideal for densely packed BGA chips and micro components.
5. Advanced Membrane Removal Technology: Optimizes efficiency with reduced mesh scraping during application, improving workflow speed. Enhances solder joint brightness, adhesion, and conductivity for professional-grade results.
Share
