1. Double-sided uniform trimming, utility model patented technology 2. The blade is from thin to thick, and the force is more uniform 3. It is suitable for removing glue from the screen and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc 4. Upgraded to a more practical bent-blade design, by bending the blade, the loss to the motherboard, chip, screen, etc is realized and reduced, thereby improving the yield 5. Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, the thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm
Verified Compatible
Guaranteed fit for your device. Wrong part? Full refund including shipping.
