1. Dual-Sided Platform for Maximum Efficiency: The BH17 features a practical dual-sided design, allowing technicians to switch between different BGA chip types without replacing the platform. Perfect for high-volume repair environments where efficiency matters. 2. Strong Magnetic Positioning for Stable Reballing: Built-in strong magnets securely hold the CPU/BGA chip in place, preventing shifting during paste application and hot-air reflow. This ensures perfect alignment and reduces solder bridging or defects. 3. Designed Specifically for CPU & BGA IC Reballing: Engineered for CPU and various BGA IC packages, the BH17 provides precise stencil alignment and uniform solder ball placement, making it ideal for professional motherboard and smartphone repair. 4. High-Precision CNC Build for Perfect Stencil Fit: Crafted with CNC machining for exceptional accuracy, the platform ensures the stencil fits tightly against the chip surface. This guarantees consistent, high-quality reballing results for demanding technicians. 5. Heat-Resistant & Durable Construction: Constructed with materials designed to withstand high-temperature reflow environments, the BH17 remains stable under intense heat. Durable enough for long-term, repeated use in professional repair labs. 6. Package includes: 1 x Magnetic Base 75 x Stencil
Verified Compatible
Guaranteed fit for your device. Wrong part? Full refund including shipping.
