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2UUL BG02 AB 0.3-0.85 Spacing Universal BGA Reballing Stencil
2UUL BG02 AB 0.3-0.85 Spacing Universal BGA Reballing Stencil
SKU: EDA0089204
Regular price
$21.00
Regular price
Sale price
$21.00
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In Stock
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This item is shipped from China.
Ships in 0–3 days
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1-Year Warranty
What's covered?
If your item develops a hardware fault or manufacturing defect, we've got you covered.
How we help
Our tech team is ready to test, repair, or replace your item to get you sorted as quickly as possible.
30-day returns
Fast refunds
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1. Supports multiple BGA ball pitches from 0.3mm to 0.85mm, covering most mainstream IC chips and improving repair efficiency.
2. AB universal layout allows compatibility with a wide range of BGA chips, reducing the need for multiple stencils.
3. Manufactured with advanced laser cutting technology to ensure uniform hole size, accurate alignment, and consistent solder ball placement.
4. Made from high-quality stainless steel for excellent heat resistance, durability, and long-term use without deformation.
5. Polished surface prevents solder balls from sticking, enabling faster, cleaner, and more reliable reballing results.
6. Ideal for mobile phone motherboard repair, IC chip rework, PCB maintenance, and electronics repair professionals.
2. AB universal layout allows compatibility with a wide range of BGA chips, reducing the need for multiple stencils.
3. Manufactured with advanced laser cutting technology to ensure uniform hole size, accurate alignment, and consistent solder ball placement.
4. Made from high-quality stainless steel for excellent heat resistance, durability, and long-term use without deformation.
5. Polished surface prevents solder balls from sticking, enabling faster, cleaner, and more reliable reballing results.
6. Ideal for mobile phone motherboard repair, IC chip rework, PCB maintenance, and electronics repair professionals.
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
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$21.00