1. Selection of high-quality materials, no rust, high toughness, and corrosion resistance. 2. The surface adopts vacuum plating process, which will not fade. 3. Laser high-precision cutting, neat edges without burrs, uniform shape. 4. The blade is polished by hand, carefully polished by the first-line maintenance master, and directly used without polishing. 5. Ma1.0 can be used to pry IC and CPU glue removal. 6. Ma2.0 is a corner knife, which can be used to scrape the glue around the IC. 7. Ma3.0 is a special-shaped rubber tapping knife, which can cut vinyl without damaging the board.
Verified Compatible
Guaranteed fit for your device. Wrong part? Full refund including shipping.
