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YCS Divine Dragon Flame CH898 Motherboard Layer Separation Heating Stage, Plug:EU Plug
YCS Divine Dragon Flame CH898 Motherboard Layer Separation Heating Stage, Plug:EU Plug
SKU: EDA010208001
Prix habituel
$68.00
Prix habituel
Prix promotionnel
$68.00
Frais d'expédition calculés à l'étape de paiement.
Duties & Import Tax Information
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In Stock
CHN
This item is shipped from China.
Processed in 0–3 days
Quantité
Impossible de charger la disponibilité du service de retrait
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1. The YCS Divine Dragon Flame CH898 Heating Stage is engineered for precision repair of mobile phone motherboards, supporting layer separation, lamination, and dot matrix repair. It delivers consistent, even heating to protect delicate components during complex repairs.
2. Adjustable temperature: 40 to 260 degrees Celsius (via digital controls). One-click switching for 3 common presets: 100 / 220 / 240 degrees Celsius (ideal for micro-soldering/Android/Apple and multi-excavation repair modes).
3. The 96x53mm oversized platform fits most mobile phone motherboards (and small PCBs). Its aluminum alloy construction ensures rapid, uniform heat distribution—boosting repair efficiency by 30%+ compared to standard stages.
4. Stable, scratch-free clamps secure your motherboard in place. The arms slide along dedicated slots (front/back of the platform) and rotate 360 degrees, enabling easy access to all edges for precise, hassle-free repairs.
5. Aluminum alloy heating technology eliminates hot spots, ensuring consistent temperature across the entire platform. This reduces repair time and prevents thermal damage to sensitive components.
6. Compact & Lightweight: Fits any workspace (desk/repair bench) without clutter.
7. Clear Dual Display: Real-time temperature (degrees Celsius) and time tracking for precise control.
8. Anti-Slip Feet: Rubber pads on the base prevent slipping during operation.
2. Adjustable temperature: 40 to 260 degrees Celsius (via digital controls). One-click switching for 3 common presets: 100 / 220 / 240 degrees Celsius (ideal for micro-soldering/Android/Apple and multi-excavation repair modes).
3. The 96x53mm oversized platform fits most mobile phone motherboards (and small PCBs). Its aluminum alloy construction ensures rapid, uniform heat distribution—boosting repair efficiency by 30%+ compared to standard stages.
4. Stable, scratch-free clamps secure your motherboard in place. The arms slide along dedicated slots (front/back of the platform) and rotate 360 degrees, enabling easy access to all edges for precise, hassle-free repairs.
5. Aluminum alloy heating technology eliminates hot spots, ensuring consistent temperature across the entire platform. This reduces repair time and prevents thermal damage to sensitive components.
6. Compact & Lightweight: Fits any workspace (desk/repair bench) without clutter.
7. Clear Dual Display: Real-time temperature (degrees Celsius) and time tracking for precise control.
8. Anti-Slip Feet: Rubber pads on the base prevent slipping during operation.
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
Partager
$68.00