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RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
SKU: TBD0606459901
Prix habituel
$17.00
Prix habituel
Prix promotionnel
$17.00
Frais d'expédition calculés à l'étape de paiement.
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In Stock
CHN
This item is shipped from China.
Processed in 0–3 days
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1. Pure copper gold-plated needle, tinning speed increased by 50%
2. Ball head design, can go deep into the gap, quickly complete the row of pins drag tin, and not easy to scratch the motherboard
3. Containing 5 tin dragging pins, even/fast, full of tin
4. Can be easily operated in small space, not easy to scratch the inline holder
5. Suitable for motherboard maintenance tin drag, especially suitable for BGA package chip tin drag
6. Size: Handle about 11.8 x 0.8cm, Needle about 2 x 0.12cm
7. Net weight: about 21.4g
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
Partager
$17.00