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QIANLI F1X Smart Motherboard Layered Laying Curve Heating Platform, Plug:EU Plug
QIANLI F1X Smart Motherboard Layered Laying Curve Heating Platform, Plug:EU Plug
SKU: EDA010216601
Prix habituel
$120.00
Prix habituel
Prix promotionnel
$120.00
Frais d'expédition calculés à l'étape de paiement.
Duties & Import Tax Information
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In Stock
CHN
This item is shipped from China.
Processed in 0–3 days
Quantité
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1. Supports multi-point temperature settings, with both standard curve and peak reflux modes.
2. Covers most mobile phone motherboard sizes, ensuring uniform heat conduction and consistent heating across the entire motherboard.
3. Slide-type rotatable clamp with spring-loaded structure, capable of securing motherboards and modules of different sizes.
4. Color display shows real-time temperature, temperature curve, and operating status.
5. Equipped with a Type-C data communication interface and power interface, compact design saves workbench space.
6. Used for motherboard layering, BGA chip desoldering, motherboard separation, and other repairs, adaptable to various international environments.
2. Covers most mobile phone motherboard sizes, ensuring uniform heat conduction and consistent heating across the entire motherboard.
3. Slide-type rotatable clamp with spring-loaded structure, capable of securing motherboards and modules of different sizes.
4. Color display shows real-time temperature, temperature curve, and operating status.
5. Equipped with a Type-C data communication interface and power interface, compact design saves workbench space.
6. Used for motherboard layering, BGA chip desoldering, motherboard separation, and other repairs, adaptable to various international environments.
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
Partager
$120.00