1
/
von
7
No reviews
Mr.Yang Adjustable IC Chip Degumming Station
Mr.Yang Adjustable IC Chip Degumming Station
SKU: EDA0102160
Normaler Preis
$31.00
Normaler Preis
Verkaufspreis
$31.00
Versand wird beim Checkout berechnet
Duties & Import Tax Information
Duties are only included if shown at checkout. Otherwise, your local government may apply customs fees, which your courier will collect directly from you before delivery.
In Stock
CHN
This item is shipped from China.
Processed in 0–3 days
Anzahl
Verfügbarkeit für Abholungen konnte nicht geladen werden
Shipping info
To find all available shipping methods and exact delivery times, add the product to your cart and check using our shipping calculator.
30-day returns
Fast refunds: Once we receive and check your item, we aim to process your refund within 48 hours.
Return postage: Just changed your mind? You'll need to cover the return postage. If the item arrived faulty, we'll cover the cost to get it back to us.
Your details are safe
We treat your data the way we'd want ours treated. Your payment details are locked down with bank-level encryption. We never actually see your credit card numbers, and we will absolutely never sell your personal information.
1. Dual-station worktable for easy adhesive removal
2. Tempered glass, high temperature resistant and easy to clean
3. Precisely adjustable clamping width, compatible with chips of various sizes
4. Suitable for adhesive removal and pin repair of BGA, CPU, IC and other components
5. Specifically designed for removing black adhesive from mobile phone CPUs, memory ICs, power management ICs and various BGA chips, cleaning solder balls and repairing pins
6. Employs a steplessly adjustable clamping structure, equipped with dual thickness limiting baffles (0.2mm / 0.4mm) and a high-temperature resistant tempered glass work panel, enabling stable chip fixation, safe adhesive removal and efficient chip refurbishment.
2. Tempered glass, high temperature resistant and easy to clean
3. Precisely adjustable clamping width, compatible with chips of various sizes
4. Suitable for adhesive removal and pin repair of BGA, CPU, IC and other components
5. Specifically designed for removing black adhesive from mobile phone CPUs, memory ICs, power management ICs and various BGA chips, cleaning solder balls and repairing pins
6. Employs a steplessly adjustable clamping structure, equipped with dual thickness limiting baffles (0.2mm / 0.4mm) and a high-temperature resistant tempered glass work panel, enabling stable chip fixation, safe adhesive removal and efficient chip refurbishment.
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
Teilen
$31.00