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Mijing iRepair MS1 Platform Expansion Module For iPhone 15 Pro MaxBack Camera
Mijing iRepair MS1 Platform Expansion Module For iPhone 15 Pro MaxBack Camera
SKU: EDA010481110
Normaler Preis
$26.00
Normaler Preis
Verkaufspreis
$26.00
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This item is shipped from China.
Processed in 0–3 days
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1. Precise Positioning: Model-specific heating modules provide accurate motherboard alignment for repair tasks.
2. Motherboard Layer Separation: Designed for compatible multilayer PCB separation and desoldering applications.
3. Interchangeable Design: Easily switch modules to accommodate different models and repair requirements.
4. Versatile Repair Applications: Compatible specialized modules support selected motherboard and CPU repairs.
5. Expandable Compatibility: Upgrade your existing MS1 platform with additional modules for supported models.
Note: This product is only compatible with the Mijing iRepair MS1.
2. Motherboard Layer Separation: Designed for compatible multilayer PCB separation and desoldering applications.
3. Interchangeable Design: Easily switch modules to accommodate different models and repair requirements.
4. Versatile Repair Applications: Compatible specialized modules support selected motherboard and CPU repairs.
5. Expandable Compatibility: Upgrade your existing MS1 platform with additional modules for supported models.
Note: This product is only compatible with the Mijing iRepair MS1.
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$26.00