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MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning
MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning
SKU: TBD0606066501
Normaler Preis
$19.00
Normaler Preis
Verkaufspreis
$19.00
Versand wird beim Checkout berechnet
Duties & Import Tax Information
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In Stock
CHN
This item is shipped from China.
Processed in 0–3 days
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Verfügbarkeit für Abholungen konnte nicht geladen werden
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30-day returns
Fast refunds: Once we receive and check your item, we aim to process your refund within 48 hours.
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1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor
2. Bright solder joints, no resistance, non-conductive
3. Less residue, less smoke, good flow performance
4. No short circuit, no need to clean, infinite conductivity
5. Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc.
6. Weight: about 20g
7. Size: about 12.7 x 2.9cm
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
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$19.00