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JTX M29 Middle Layer BGA Reballing Stencil Tin Planting Platform for iPhone X to 17 Pro Max
JTX M29 Middle Layer BGA Reballing Stencil Tin Planting Platform for iPhone X to 17 Pro Max
SKU: EDA0101261
Normaler Preis
$101.00
Normaler Preis
Verkaufspreis
$101.00
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1. Dedicated soldering fixture for mid-layer motherboard repair, suitable for mid-layer resoldering repair of Apple 11-17 series motherboards.
2. Zero positioning error and no wobbling; precise alignment of the motherboard and stencil for stable soldering results.
3. Built-in strong magnet automatically attracts and fixes the soldering stencil, eliminating the need for manual alignment; the stencil remains stable and does not shift during the soldering process.
4. Anti-static and corrosion-resistant; withstands high-temperature operation with hot air guns; prevents solder explosion and improves repair and soldering efficiency.
5. Square-hole stencil is less prone to clogging; ensures even and full soldering, guaranteeing the quality of mid-layer solder joints on the motherboard.
6. Shared base; only the positioning mold and stencil need to be replaced to adapt to different models.
2. Zero positioning error and no wobbling; precise alignment of the motherboard and stencil for stable soldering results.
3. Built-in strong magnet automatically attracts and fixes the soldering stencil, eliminating the need for manual alignment; the stencil remains stable and does not shift during the soldering process.
4. Anti-static and corrosion-resistant; withstands high-temperature operation with hot air guns; prevents solder explosion and improves repair and soldering efficiency.
5. Square-hole stencil is less prone to clogging; ensures even and full soldering, guaranteeing the quality of mid-layer solder joints on the motherboard.
6. Shared base; only the positioning mold and stencil need to be replaced to adapt to different models.
Verified Compatible
Guaranteed fit for device in the title. Wrong part? Full refund including shipping.
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$101.00